Hybrid ICs are true semiconductor parts that are batch-process fabricated and, as such, have huge potential to create low cost, high yield, scalable, high volume products.

Cubic Wafer’s unique integration process provides significant, inherent benefits such as: high connection density, up to 1 million contacts per square centimeter, material flexibility, compatibility with semiconductor and passive device processes, robust thermal properties, shear strengths of 1,500 Kg/cm2, scalability, and cost-efficient manufacturability.