Based in Austin, Texas, Cubic Wafer is a privately owned company that develops proprietary process technology and performs design services that enable dense vertical integration of semiconductors without the use of wire bonds, adhesives, or spacers and without the size and scalability limitations of conventional flip-chip bonding.

Cubic Wafer’s patented integration process technology applies standard semiconductor processing technology to individual ICs and then fuses multiple ICs together to simultaneously form many electrical, mechanical and thermal bonds that are one-hundred times smaller in area and one-thousand times shorter than today’s semiconductor I/O connections. The result is that multiple chips of any material type or complexity are literally merged into a single 3D chip.

As a result of this unlimited integration capability, a Cubic Wafer 3D chip realizes and improves upon the best advantages of system-in-package and system-on-chip such as: order of magnitude denser interconnects, the ability to leverage best-in-class materials and suppliers, lower cost, faster time-to-market, lower power, more efficient design, and breakthrough chip architectural capability. Chips can be designed to take full advantage of our process or can be used to provide significant advantages to existing customer chips with no redesign required. The result is dramatically lower cost, higher density, higher performance, multi-material, and multi-functional ICs for the consumer electronics, digital, wireless and datacom industries.

Our Vision
“Restoring the relevance of Moore’s Law”

Our vision is to create a profound and meaningful change in the way electronic systems are designed today. Imagine a hand-held device that fits into your pocket and incorporates everything you could possibly need—from your cell phone and PDA, to your digital camera, game system, and MP3 player—all in one. Now, imagine all of this functionality running on a single chip the size of your fingernail. By taking all the semiconductor chips required to perform these tasks, regardless of their material composition, and fusing them together, Cubic Wafer enables the semiconductor industry to push the envelope of integration, functionality, miniaturization, power and cost.

For example, a Cubic Wafer IC could fuse a group of individual ICs of different types (90nm silicon, 0.5um silicon, SiGe, and GaAs, Analog, Digital, SRAM, and DRAM) with a million communication contacts per square centimeter, in a fraction of the space of a multi-chip module, with more transistors than the largest chip on the market at a lower cost than an equivalent system-on-chip solution.

Our Mission
Electronics has evolved from discrete transistors to ICs. Our mission is to advance electronics to its next incarnation, the Cubic Wafer 3D chip, and to proliferate this new platform technology to all electronic containing systems everywhere.

Cubic Wafer is the innovator and developer of technology that unleashes the potential of integrated circuits, simultaneously creating a fundamental and exponential shift in the capabilities of semiconductors for virtually every application imaginable. Our proprietary technology platform opens the door to unsurpassed performance, price and power, primarily through our ability to accomplish 3D stacking and electronic integration of chips at the wafer and die level, unencumbered by the use of wire bonds, insulating adhesives, spacers, conventional flip-chip materials, or post-integration metallization or etching.

In this new integrated circuit environment, “The chip becomes the board.” In addition, by integrating multiple technologies: logic, memory, wireless, optical, we can “blur the boundary between systems and the network.” By taking chips at the wafer and die level and fusing them together, Cubic Wafer creates high-density, high-performance, multi-material and multi-functional 3D integrated circuits. Cubic Wafer’s technology can also replace expensive system-on-chip or system-in-package solutions using unlimited integration capabilities that leverage best-in-category materials and suppliers.

As a result of this radical technical breakthrough, Cubic Wafer enables the potential for revolutionary advances in applications and exponential leaps in technical capabilities for the electronics industry. This technology creates unlimited application opportunity across the semiconductor field – for gaming, memory, digital cameras, wireless, data communication and data storage, PCs, printers and networking.