Hybrid ICs impact all areas of semiconductor end-use markets, e.g., computers, consumer electronics, communications, industrial and automotive. Hybrid integrated circuit technology can be customized and used in many wide-ranging applications.
The wireless industry will benefit by combining digital, analog and/or RF technologies as well as passive RF pieces onto other silicon chips, to create a single hybrid IC chip cell phone or wireless LAN.
Similarly, by combining silicon, gallium arsenide, and multi-stack memory chips, the set-top-box, graphics, gaming, and digital television arenas will experience dramatically lower cost, power, and product size while increasing functionality and speed.
In addition to the active optical device clusters, additional silicon electronics integration reduces cost, size and power for routers, switches, hubs, and network adapters while similarly increasing the performance of these systems. Moreover, by fusing wireless and/or optical chips with logic and memory, the ‘chip’ and ‘network’ can integrate seamlessly.
Designing memory chips that fuse memory I/O at the die level removes the necessity for off-chip drivers, improving latency, and providing a more efficient stacked system.