Hybrid integrated circuits are devices that apply standard semiconductor processing technology to individual ICs, and fuses the ICs together to simultaneously form an electrical, mechanical, and thermal bond. By applying semiconductor processing techniques to the packaging world, hybrid ICs realize the advantages of semiconductor processing. Advantages, such as extremely small and high density interconnects, lower cost, lower power, and scalability are all realized with Cubic Wafer’s patented hybridization process.

Hyrid IC technology bonds various substrates (InP, Si, SiGe, GaAs, or passive materials) either at the die level, die and wafer level or wafer to wafer level forming a single chip. This technology streamlines connections between semiconductor chips by replacing rudimentary wire bonding, huge flip-chip, or expensive system-on-chip techniques. The process fuses chips to achieve an accelerated, streamlined and far less costly process enabling high volume manufacturing of vertically integrated circuits.

Our platform technology, which restores the relevance of Moore’s Law, is best described as a proprietary, material-neutral, chip-level micro-interconnect process technology.

The technology employs standard or existing semiconductor process technology and toolsets, while simultaneously and favorably altering the cost structure of semiconductor production.

Summary
Hybrid Integrated Circuit Technology offers a new a paradigm in integrated circuit and system designs and architectures by permitting:

• Orders of magnitude increase in communication bandwidth
• Use of multiple best-of-breed materials and vendors IP in one chip
• Modular chip design
• Upgradeable parts
• Efficient use of foundry equipment
• Higher system yield
• Greater chip complexity